Contact Us 4008-220-880 Search Language
Home > On-Chip Memory > BGA NVME > OSSD-BGA NVMe nano [Beta]

OSSD-BGA NVMe nano [Beta]

Features:
• High density BGA1113 NVMe On-chip memory product
• Full compliant with NVMe 1.3 Spec.
• Built-in ECC (Error Correction Code) function.
• Advanced Dynamic/Static Wear-leveling Algorithm.
• Dynamic Power Management.
• Support S.M.A.R.T.
• Support Trim and Native Command Queuing Command.
Get A Quote
  • Overview
  • Specification
  • Dimensions
  • Applications

Overview

FORSOLID™ BGA1113 package NVMe series on-chip memory products have the characteristics of small size, light weight , high speed and high reliability, providing users with high-capacity and high density storage product solutions. It can be widely used in miniaturized applications such as handheld terminals, IoT terminals, and embedded motherboards.

Specification:

Physical Form Factor: BGA 1113
Interface: PCIe 3.0 x 2
Dimension: 11.5mmX 13mmX1.35mm
Weight: ≈0.5g
Capacity TLC: 64GB,128GB, 256GB, 512GB
Performance Sequential Read 1730MB/s
Sequential Write 1180MB/s
Random Read(4K) IOPS: 245k
Random Write(4K) IOPS: 195k
Electrical Power Supply 2.5V, 1.2V, 0.9V
Power Consumption Active: ≤1.6W
Idle:≤0.2W
Temperature Operating Temperature 0℃~70℃
Storage Temperature -40℃~85℃
Humidity 5%~95%(No Condensing)
Vibration 15g(10~2000Hz)
Shock 1500g/0.5ms
Reliability MTBF: 2000000hrs
Total Bytes Written TLC:3000 times
Certificates CE、FCC、RoHS
Optional Functions Secure Erase
Quick Erase
AES-256bit Encryption
Remarks: 1. The speed performance is related to the SSD capacity and test environments.
2. Power consumptions is related to the SSD capacity and test environments.
3. The marked capacity is the NAND Flash’s capacity, and the real available capacity will be different in different application environments, normally is around 80%~90% marked capacity.

Dimensions:



客服

邮箱

导航

联系

Get A Quote